Bridging the Gap Between Adhesive Technologies

Traditional adhesives often require manufacturers to compromise between speed, strength, flexibility, and substrate compatibility. CECCORP's Hybrid Adhesive Family combines the advantages of multiple adhesive technologies into innovative formulations designed to deliver enhanced performance where conventional products fall short.

Whether you require the instant fixturing of cyanoacrylates, the structural strength of epoxies, the versatility of acrylics, or the flexibility of elastomer-modified systems, our hybrid technologies provide a unique balance of properties to solve challenging bonding applications across manufacturing, assembly, maintenance, and repair.

CA & Epoxy Hybrid Adhesives (HY-EC3)

Combining the fast fixture speed of cyanoacrylates with the durability and gap-filling capability of epoxies.

Key Benefits

• Fast fixture and handling strength
• High structural bond strength
• Excellent adhesion to metals, plastics, wood, and composites
• Improved gap-filling capability compared to traditional CA adhesives
• Enhanced impact and peel resistance
• Long-term durability and environmental resistance

CA & Acrylic Hybrid Adhesives (HY-AC07)

A unique combination of instant bonding technology and structural acrylic performance.

Key Benefits

• Rapid bonding with structural strength
• Excellent adhesion to difficult-to-bond plastics
• Superior bonding of mixed-material assemblies
• Improved resistance to vibration and dynamic loads
• Enhanced environmental and chemical resistance
• Ideal for industrial assembly and repair applications

CA, Epoxy & Elastomer Flexible Hybrid Adhesives (HY-FL20W)

Advanced flexible structural adhesives engineered for demanding applications requiring both strength and movement accommodation.

Key Benefits

• High bond strength with exceptional flexibility
• Outstanding impact and vibration resistance
• Reduced stress concentration on bonded parts
• Excellent durability under thermal cycling
• Bonds dissimilar materials with reduced risk of failure
• Ideal for applications exposed to shock, movement, expansion, and contraction

Designed for Modern Manufacturing

CECCORP Hybrid Adhesives represent the next generation of bonding technology, combining the speed of instant adhesives with the strength, toughness, and durability of structural adhesive systems.

By bridging the gap between traditional adhesive technologies, these innovative solutions help manufacturers achieve stronger, more reliable bonds while improving productivity and simplifying assembly processes.