C-Melt C 0092

Hot melt adhesive, with synthetic resin base, used in packaging applications, such as deep-freeze and assembly of difficult substrates.

See Technical Data Sheet below, or view the PDF here.

TECHNICAL DATA
Viscosity at 160°C (Brookfield, Thermosel System) (ASTM D.3236) 1300 ± 260 mPa.s
Softening Point (R&B) (ASTM E.28) 105 ± 5 °C
Colour White
Density (MC206)

Approx. 0.92

PROPERTIES
Open time (MC 129 at 160°C) Typical value 9 – 10 s
Setting time (MC 129 at 160°C) Typical value 4 – 5 s
Heat resistance SAFT (MC218 1kgf/25mm) Typical value 65 °C

Good hot tack

Good adhesion to difficult substrates

Depending on substrates, this product can allow bonds with heat resistance up to +65 °C and cold resistance down to -40 °C

This product compared to EVA adhesive has an improved thermal stability, stays constant in its viscosity, therefore no changes in the adhesion and in the processing quality, even by longer rests in the adhesive melting machines

Low consumption adhesive, with extremely low density

Odour and smoke free

Adhesive free from organic solvents

All components comply with paragraph 21CFR175.105 of FDA Legislation

APPLICATION
For use in nozzle, roller or other applicator system
Recommended working temperature 150 – 180 °C

Temperatures above 190 °C should be avoided

The equipment needs to be freed from EVA hot melt and cleaned since this product is not compatible with EVA based hot melts

During extended machine stops it is recommended to switch off the heating

CLEANING
While hot by scrapping with a spatula and remove any rests with Hot-Melt Cleaners CC02
FORM OF SUPPLY Small pillows, approx. 20g
STORAGE Cool and dry; Storage life: at least 2 years according to our experience